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Megasonic transducer cleaning uses higher frequency ultrasonic energy in mega hertz scale to boost removal of submicron particles from substrates and chemical reactions. Compared to low frequency ultrasonic cavitations, megasonic transducer cavitations effect can give smaller particles removal as well as less damage on the substrates.
The batch type megasonic plate can be easily assembled into process tank to build batch type megasonic cleaning systems for wafers. By using special coupling technique, piezoelectric transducer precisely matches with quartz or sapphire vibration layer to efficiently emit uniform sound field into the process tank. For bulk piezoelectric transducer for sale at a competitive price, inquiry now
Megasonic transducer plate, used for assembling batch type megasonic wafer cleaning system
1MHz ultra-high frequency ultrasound, more precise sonication effect
The acoustic intensity on the surface of vibrating plate can exceed 5w/cm2
Advanced coupling technology of quartz and sapphire, no risk of impurity falling off
Ultra-low acoustic cavitation effect, no damage to device surface
High corrosion resistance, resistant to various acid and alkali solutions and organic solvents
Plate material: 316L stainless steel, quartz, sapphire
Plate size: customizable
Customizable cleaning tank
The megasonic vibrating plate can be directly installed at the bottom of the cleaning tank for secondary development
Megasonic emission sound field is evenly distributed to improve cleaning uniformity
Extremely low ultrasonic cavitation effect, no damage to device surface
High power megasonic transducer plate, the surface sound intensity of vibrating plate can reach more than 5w/cm2
Quartz or sapphire coupling technology, no risk of impurities falling off the device
It can be made of non-metallic high corrosion resistant materials, and is suitable for various acid-base and organic solvents
Unique transducer bonding and semiconductor cleaning technique provides higher stability and durability.
Megasonic generator using the third-generation semiconductor technology, fully realizing digital high-frequency and high-power drive
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No.1, Xingguang 5th Street, Opto-Mechatronics Industrial Base, Tongzhou Park, Zhongguan Village Technology Park 101111, Beijing, China
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