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Megasonic semiconductor cleaning company uses higher frequency ultrasonic energy cleaning in mega hertz scale to boost removal of submicron particles from substrates and chemical reactions. Compared to low frequency ultrasonic cavitations, megasonic cavitations effect can give smaller particle removal as well as less damage on the substrates.
Shower type megasonic cleaning equipment integrates the megasonic transducer into the nozzle. The megasonic nozzle sprays the fluid with megasonic energy onto the surface of substrates such as wafers to accomplish the semiconductor cleaning process. The advantage of shower type megasonic cleaning is that it can directly make the point to point process on the substrate surface. The megasonic focus point can be directly put onto the wafer surface and then it realizes the entire surface process by moving the wafer and megasonic nozzle. Compare to batch type megasonic cleaning, the transfer efficiency of megasonic power on shower type is higher. The issue on batch type megasonic cleaning that the sound field changes as liquid depth changes in the tank can be avoided. The shower type megasonic cleaning is able to provide more uniform sound field on the surface of substrate. In addition, the shower type cleaning doesn’t have the second pollution due to particles cleaned away from the substrates in the cleaning fluid in the tank.
Single point shower type, no secondary pollution
Ultra-high frequency ultrasound, up to 3MHz
High cleaning precision, ability to remove particles in 0.2 micron
Ultra-low cavitation effect, no damage to device surface
No metal materials contact with liquid, no risk of conductive substances falling off
High corrosion resistance, workable with various acid and alkali solutions and organic solvents
Solve the problem of secondary pollution of cleaning solution.
Extremely low ultrasonic cavitation effect, no damage to device surface
Ultra-high cleaning precision, which can remove dirt particles in 0.2 micron on the object surface
Made of non-metallic high anti-corrosion materials, suitable for various acid-base and organic solvents
Quartz or sapphire coupling layer technology, no risk of impurities falling off the device
Unique transducer bonding technology gives higher stability and durability
Megasonic generator using the third-generation semiconductor technology, fully realizing digital high-frequency and high-power drive
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No.1, Xingguang 5th Street, Opto-Mechatronics Industrial Base, Tongzhou Park, Zhongguan Village Technology Park 101111, Beijing, China
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